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etch@VACCO.com
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Precision Photo Etching
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VACCO Industries
10350 Vacco Street
El Monte, CA 91733
Tel: 626.443.7121
Fax: 626.350.0533
Email:
etch@VACCO.com
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Precision Photo Electroforming
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Precision Photo Electroforming
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Precision parts can be manufactured with fine patterns, stepped multi-level features, high tolerances, and superior edge finishes by our photo electroforming process. Complete design assistance is available to customers for converting the pattern sketches to 2D CAD files. Our electroformed parts are extensively used in avionic systems, medical devices, electronics, and scientific controls.
Image transfer is done on multi-level electrodeposited metal products to create overgrown profiles. In the past, we have electroformed multi-level filter materials with unique hex support grids and holes as small as 40 µm for our customers. Precision filters, mesh, plus sieves are produced with zero particle entrapment, easy to clean features, and apertures down to 3 µm in size. We have electroformed a wide range of micro-embossing tools as well as multilevel dies for electronic and scientific control applications. Processing material panels in nickel, gold, copper, or any polymer, in sizes as large as 18” x 24”, is not a problem for us. Depending upon the mandrel material, we can provide photo electroformed parts with rough surfaces or optical finishes.
Specifications
Primary Services
Adhesive Bonding
Diffusion Bonding
Laser Micro Machining
Photo Electroforming
Photo Etching
Value-added Services
Embossing
Heat Treating
Kiss Cutting
Marking
Special Packaging
Plating
Welding
Assembly
Bonding
Material List
Copper
Epoxy
Gold
Nickel(Both hard and soft)
Polymer
Material Thickness
Can be as thin as 3-4 microns
Thickness Uniformity/Level
< 1% of material thickness possible
Hardness(VPN)
190 - 450
Roughness
Dependent Upon Mandrel Material
Optical Finish Possible
Maximum Panel Size
Material panels as large as 18” x 24”
Minimum Dimensional Tolerance
Generally +/-10 microns or better
Positioning Accuracy
Normally +/- 1-2 microns
Through Holes Size
As small as 2-3 microns
Aperture Sizes
< 1 to 3 µm
Feature Sizes
< 1 to 3 µm
Pitch
< 2 to 6 µm
Aspect Ratios/level
10:1 to 2:1
Typical Profiles
Overgrown and Multi-Level
Stepped Multi-Level
Software Used
AutoCAD
Autodesk Inventor
COSMOS
Ansoft Maxwell 2D
Acceptable File Formats
DWG
DXF
IGES
JPEG
PDF
Certifications
AS 9100 Certified
Clean Room Accredited to FED-STD-209 Class 10,000 Standards
FDA Registered
PRI / NADCAP Certified
Applications
Avionics
Embossing Micro Parts
Filtration/Microfiltration
Laboratory and Test
Masking
Micro-channels
Micro-circuitry
Micro-embossing Tools
Micro-reactors and Lab-on-chip
Micro-replication of Silicon Masters
Precision filters, mesh, and sieves
Industries Served
Automotive
Avionic/Space
Electronic
Fiber
Mechanical/Manufacturing
Medical
Printers
Scientific Controls
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